Chap 1: Economic benefits ease of manufacture more reliable Chap 2: basics of nailing down a design risk points - You need to identify risk and perform experiments that nail down what results can be expected from circuit designs simulations - my feelings - you only simulate what you think is an issue - expect to be surprised at least a little and probably at least one big issue on designs architectures you have not done before block diagragm *signal levels - linearity IM3 P1db *Noise chart if appropriate *spur calculations - much can be done with a simple spread sheet Chap 3: After the Disaster What happened? cut out board shield areas and string them down to another board. Why it worked Chap 4: General theory of schematic capture Why one page one shield area Use whatever paper size you need if the area is huge then use a block in its place It is about communications to your layout guy or to yourself - no substitute for clarity ...these designs may pass through several sets of hands. It is a visual art. Don't lay things out like a digital guy! Think Visual! Make a map with area estimates Chap 5: Layer Stacks There are many variants depending on how low your spurious signals need to be High levels of integration - an assymtotic design > Design for FCC You can do it any way you like however it must be systematic. If not you or your pcb layout guy will likely err. Example: microstrip box only - only outside of box ground stripline ground box only cross overs ground harness 1 harness 2 ground Chap 6: Theory of signal isolation Faraday cages Cross overs are BAD dufferential sig - why it is used in IC's. Visualize the paired equal currents 200 Mhz wire wrap board with ECL ...all the waveforms were beautiful Wave Guides - the 1/4 wave insulator - milled chassis channels are wave guides! low frequency magnetic coupling split ground planes shields beads bypass capacitors regulators and big electrolytic caps controller impedance lines Paired currents - how a wave really travels - draw the current loop AKA photon terminated lines versus open lines - which pipe leaks? one with low pressure flow or one with high pressure water with no flow? microphonics - synthesizer issues- film caps vibration Pi filters - avoid using common ground point on grounded side of parts Chap 7: Sources of spurious Low frequency: power rails High frequency: crossed lines capacitive, inductive, ground current Chap 8: Transmission structures differential microstrip stripline - need to stitch CPWG - can be used to transition and bring currents up to the top surface of a board